The (CDP) interposer uses conductive diamond particles to form a superior, multi-point connection system. The rough (CDP) surface pierces any contaminants on either the DUT leads or test contacts. The resulting contact resistance is fewer than 5 milliohms with no measurable inductance or capacitance after thousands of mate/demate cycles. This controlled impedance material is electrically invisible, requires as little as 10 grams contact force, and resists oil and dirt contaminates
Conductiver Diamond Plating(CDP) has been used in military systems, including super computers and satellites, while meeting all military environmental specifications. (CDP) enables 10 – 40 Gbps devices to perform the same or better within socket applications than if they were soldered directly to the board, thereby opening opportunities for a new lead- free interconnect technology.
Giga Connections, Inc. Electroless vs Electrolytic Conductive Diamond Plaiting Technology