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| Close-up of Conductive Diamond Plating |
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| Conductive Diamond Plating (CDP) Description
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| Conductive Diamonds |
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The (CDP) interposer uses conductive diamond particles to form a superior, multi-point connection system. The rough (CDP) surface pierces any contaminants on either the DUT leads or test contacts. The resulting contact resistance is fewer than 5 milliohms with no measurable inductance or capacitance after thousands of mate/demate cycles. This controlled impedance material is electrically invisible, requires as little as 10 grams contact force, and resists oil and dirt contaminates
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Conductiver Diamond Plating(CDP) has been used in military systems, including super computers and satellites, while meeting all military environmental specifications. (CDP) enables 10 – 40 Gbps devices to perform the same or better within socket applications than if they were soldered directly to the board, thereby opening opportunities for a new lead- free interconnect technology.
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| Giga Connections, Inc. Electroless vs Electrolytic Conductive Diamond Plaiting Technology |
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