Non-Destructive Die Extraction and Package Reassembly
Giga Connections, Inc Clean Room
Giga Connections, Inc. (GCI) performs a wide variety of highly specialized engineering services for diverse semiconductor applications. Services include using GCI proprietary processes for "die removal" or "die harvesting" to remove die from plastic and ceramic packages without damaging the die. These die can then be reassembled into ANY available ceramic or plastic packages.
This is a proven approach to greatly increase product survivability in rugged and/or high temperature applications that require ceramic packages where those ICs are available in plastic packages but are NOT commercially available in ceramic packages. Although some packages are more difficlut than others, GCI has yet to encounter a plastic or ceramic package where it was not able to successfully remove without damage to the die.
Move die from plastic packages to rugged ceramic packages - extends the usable lifetime of an IC typically by 10X to 20X at 185C
Reassemble previously removed die into any available package – plastic or ceramic
Create Multi Chip Modules (MCM) from packaged ICs
Die Removal Process does NOT induce damage to the die
Locate Counterfeit circuitry in Die for Intellectual Property (IP) Verification and Litigation
Commercial Die Extraction and Reassembley technique to reduce Military component obsolescence
Solving Microelectronics Obsolescence Through Die Extraction andReassembly for Military Systems
A Proven Solution to Provide Management Support for Diminishing Manufacturing Sources and Material Shortages (DMSMS)
Download the latest Presentation on how Giga Connections, inc. proven die extraction and reassembly service can remove die from ANY package and reassemble them into ANY available package that can be part of your (DMSMS) program to reduce obsolete components using low cost component alternate/ replace solution for either military or COTS components.
This service provides more sources of commercially available components are available for substitution of obsolete components with an alternate component with in Military weapons systems.
Benefits for die extraction and reassembly:
* Reduces internal engineering resources * Is proven to be the lowest cost for replacing obsolete microelectronics. If you have a component that is obsolete please contact us for a quote on the following services
1)You have a die in a package style not compatible with your system design and want it installed in a obsolete package. 2)You have your own assembly service and would like high/low volume die extracted and provided to your chosen assembly service 3)You need a plastic die removed, put on ceramic, and tested to >220c+ for use in high temperature and caustic military environments. 4)You have a package, need the existing die removed and a new die put in its place, re bonded and capped.
We have extensive experience in removing die from all popular plastic as ceramic packages.
Even though some packages are much more difficult than others, we have yet to encounter a plastic or ceramic package where we were not able to successfully remove the die without damaging the die.
We have been successfully performing this service for many years for a wide variety of customers.
How the GCI Die Removal Service Saves Time and Money
Example #1 - A customer’s high-temperature, rugged application requires ICs packaged in ceramic packages but the needed ICs are only commercially available in plastic packages.GCI will extract the die from the plastic packages and re-assemble those die into rugged ceramic packages.This typically increases survivability by more than 10X in rugged, high- temperature environments.
Example #2- A customer wants to build a few hundred engineering samples in a specific package, a flip-chip assembly or a multi-chip module (MCM) but cannot purchase die in quantities smaller than 10,000 units. However, small quantities of packaged units in an unwanted plastic package are immediately available. GCI will extract the die from these packages and reassemble them into the desired packages or supply “bare die” for an MCM application as desired.
Example #3 - A customer urgently requires a die in a package that is not readily available. Die removal and reassembly provides a viable option to waiting several weeks or indefinitely for additional silicon from a fab or foundry. If the die are available in ANY package, GCI can expedite a die removal order and either overnight the bare dice to the desired location, sometimes on the same day, or re-assemble into the desired package avoiding weeks of delay or longer.
GCI can re-attach a bond wire and return it within days saving time and money
Wire Bonding Repair Service
- There are also occasions where a bond wire was inadvertently missed or misbonded due to an incorrect wire bond diagram that was discovered after a limited quantity of custom die had been encapsulated in a plastic package.It is often much quicker to have GCI repair it rather than wait to procure die for a new build.
PRICING * Non-destructive die removal is a highly labor-intensive process.Pricing for lots within the 200 to 400 unit range is generally about $30 per die for small die but could be more depending on the die size and the complexity of the job. Smaller lot sizes may have a higher price per unit and larger lot sizes may have a lower price per unit due to economies of scale. The minimum lot charge is $1000 per lot.
CYCLE TIME The standard production cycle time is three days from receipt to overnight return shipment. This can be expedited to a two-day, one-day or in some cases a same-day turn, if required. In a same-day turn, packages are received with an early AM delivery, and the bare dice will then ship via overnight to whatever address you specify later that same day.
Distributors and Assembly houses have the option to refer Die Extraction, Reassembly, or Wire Bonding Repair customers to GCI or subcontract this work to GCI.
GCI has taken side-by-side accelerated life test empirical data at 250C using the same silicon dice packaged in plastic ICs vs. packaged in ceramic ICs. The ceramic ICs contained dice that were removed from the same lot as the plastic ICs that were selected using a random sample. With every pin periodically tested for continuity at periodic readpoints after baking in an oven at 250C, the results showed the plastic packaged die began to fail showing "opens" after only 81 hours at 250C (which is equivalent to 350 hours at 185C) while the same die reassembled into ceramic packages began to show "opens" only after more than 1000 hours at 250C (which is equivalent to 16,000 hours at 185C). This data clearly demonstrates that the lifetime of the repackaged ceramic ICs was increased by more than 10X over the lifetimes of the plastic ICs at high temperatures.
Giga Connections, Inc. 4182 Center Park Dr Colorado Springs, CO 80916-4505