Giga Connections, inc. - Die Removal and Wire Bond Repair

Giga Connections, Inc Clean Room

We have found that once this capability is known to be available, many of our customers have found that this is often the "best available option" for low volume Prototype Development.

How the GCI Die Removal Service Saves Time and Money

 - There are occasions where a customer wants to build a few hundred engineering samples in a specific package, a flip-chip assembly or a multi-chip module (MCM) but they cannot purchase die in quantities smaller than 10,000 units due to IC manufacturer minimum order quantities. Small quantities of packaged units in a different plastic package, however, are immediately available at a far lower cost. GCI will extract the die from the package for a small fee making these dice available for reassembly into the desired package, flip-chip assembly or MCM within a few days and available for design applications in a day or two. 


- There are other occasions where a die is urgently required in a different package than the package in which they are readily available.  This option is often greatly preferable to waiting 12 weeks for another lot of silicon from a fab or foundry, especially when only a few hundred die are required and are immediately available in a different package configuration. GCI can expedite a die removal order and then FedEx these bare dice to the desired location as quickly as the same day that the packaged units are received thereby saving the project weeks of delay.

Wire Boding Repair Service

- There are also occasions where a bond wire was inadvertently missed or misbonded due to an incorrect wire bond diagram that was discovered after a limited quantity of custom die had been encapsulated in a plastic package.  It is often much quicker to have GCI repair it rather than wait to procure die for a new build.